Cantilever Microprobes For Contacting Electronic Components
AssigneeMicrofabrica Inc.
InventorsRichard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
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AssigneeMicrofabrica Inc.
InventorsRichard T. Chen, Ezekiel J. J. Kruglick, Christopher A. Bang, Dennis R. Smalley, Pavel B. Lembrikov
Estimating the term…
Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
A compliant probe for making contact with an electronic circuit element, the probe comprising:
A compliant probe for making contact with an electronic circuit element, the probe comprising:
A compliant probe for making contact with an electronic circuit element, the probe comprising:
Dependencies are inferred from the claim text.