Test socket for testing semiconductor chip package and method of manufacturing the same

15-30. (canceled)

A test socket for providing electrical connections between terminals of a semiconductor chip package and corresponding test terminals of a test device when the semiconductor chip package is positioned along a first side of the test socket and the test device is positioned along a second, opposite-facing side of the test socket, the test socket comprising:

• a base material that includes an elastic insulating material;
• a plurality of separated conductive particle structures extending through the base material between the first and second sides of the test socket, each conductive particle structure arranged to provide an electrical connection between a terminal of a semiconductor chip package adjacent the first side of the test socket and a terminal of a test device adjacent the second side of the test socket;
• wherein the conductive particle structures comprise a plurality of conductive particles having a core portion, a coating layer surrounding the core portion, and at least an insulating wire extending from the surface of the conductive particle and bonded at an end to the surface of the conductive particle with a bonding material having a thiol function group (—SH), an amine functional group (—NH2), or a carboxyl function group (—COOH).