Loading patent…
AssigneeSunPower Corporation
InventorsEmmanuel Chua ABAS, Chen-An CHEN, Diana Xiaobing MA, Kalyana Bhargava GANTI, Edmundo Anida DIVINO, Jake Randal G. ERMITA, Jose Francisco S. CAPULONG, Arnold Villamor CASTILLO
Estimating the term…
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
A substrate carrier for electroplating a plurality of substrates, the substrate carrier comprising:
A substrate carrier for electroplating a plurality of substrates, the substrate carrier comprising:
A substrate carrier for electroplating a plurality of substrates, the substrate carrier comprising:
Dependencies are inferred from the claim text.