Substrate holder and plating apparatus

A plating apparatus comprising:

• a plating bath capable of holding a plating solution therein;
• a substrate holder configured to be able to hold a substrate;
• an anode disposed in the plating bath;
• and
• a power source capable of applying a voltage between the anode and the substrate held by the substrate holder,
• the substrate holder including
• a seal ring which can be brought into contact with a peripheral portion of the substrate,
• a support ring supporting the seal ring, and
• a fixing ring pressing the seal ring against the support ring, the fixing ring including an annular portion having an inner circumferential surface and an outer circumferential surface, each of which is constituted by a tapered surface, the fixing ring further including a seal-ring pressing portion connected to the annular portion, and a regulation ring projecting radially inwardly from the seal-ring pressing portion, the regulation ring having an inside diameter which is smaller than an inside diameter of the seal ring.