Manufaturing method of casing of electroing device
AssigneeHTC Corporation
InventorsCheng-Han Chung, Chao-Feng Wan
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Abstract
A manufacturing method of a casing of an electronic device including the following steps is provided. First, a casing body is formed by an injection molding technology, and the casing body includes a button portion. Thereafter, a sensing assembly is electroplated on an inner surface of the casing body. The sensing assembly includes a first conductive line and two first contacts. The first conductive line forms a strain sensing pattern on the button portion, and the two first contacts connect to two ends of the first conductive line, respectively.
Claims4
A manufacturing method of a casing of an electronic device, comprising:
- forming a shell by an injection molding technology, and the shell comprising a button portion;
- and
- electroplating a sensing assembly on an inner surface of the shell, the sensing assembly comprising a first conductive line and two first contacts, wherein the first conductive line forms a strain sensing pattern on the button portion, and the two first contacts connect to two ends of the first conductive line, respectively.
Dependencies are inferred from the claim text.