Aluminum deposition devices and their use in spot electroplating of aluminum

A method for spot electroplating aluminum onto a metallic substrate without submersion or dipping of the metallic substrate in an electroplating bath, the method comprising:

• (i) spot coating said metallic substrate with an aluminum ion-containing electrolyte contained within a protective structure possessing at least one aperture, and releasing said aluminum ion-containing electrolyte from said at least one aperture onto said metallic substrate to form a coating of said aluminum ion-containing electrolyte onto said metallic substrate, wherein said aluminum ion-containing electrolyte is in contact with an anode;
• and
• (ii) applying a voltage potential between the anode and said metallic substrate as cathode when said aluminum ion-containing electrolyte is released from said aperture and forms a coating on said metallic substrate, wherein said coating of electrolyte conducts electrical current between said anode and metallic substrate, to produce a coating of aluminum on said metallic substrate within an area bounded by the coating of said aluminum ion-containing electrolyte.