Zinc immersion coating solutions, double-zincate method, method of forming a metal plating film, and semiconductor device

A method of forming a metal plating film on a material that is aluminum or an aluminum alloy, comprising:

• an etching step of etching said material by an etching solution containing copper ions,
• a residue removal step of removing etching residues from said material going through said etching step using a stripping solution capable of dissolving copper,
• a first zinc immersion coating step of immersing said material in a zinc immersion coating solution at least containing a zinc compound, an alkali hydroxide, an iron salt, a chelating agent for complexation of iron ions, and a zinc immersion coating inhibitor, said zinc immersion coating inhibitor being at least one out of the group consisting of a polymer of a secondary amine, a polymer of a tertiary amine, and a polymer of a quaternary amine, or a copolymer containing the same,
• a step of immersing said material in an aqueous solution of nitric acid,
• a second zinc immersion coating step of immersing said material in a zinc immersion coating solution at least containing a zinc compound, an alkali hydroxide, an iron salt, a chelating agent for complexation of iron ions, and a zinc immersion coating inhibitor, said zinc immersion coating inhibitor being at least one out of the group consisting of a primary amine, a secondary amine, and a tertiary amine, and
• a plating step of forming a metal plating film on said material by plating after said second zinc immersion coating step.

A semiconductor device including an aluminum or aluminum alloy electrode having a metal plating film thereon, wherein:

• said metal plating film has been formed by etching said electrode by an etching solution containing copper ions, then removing etching residues from said electrode using a stripping solution capable of dissolving copper, then immersing said electrode in a first zinc immersion coating solution, then immersing said electrode in an aqueous solution of nitric acid, then immersing said electrode in a second zinc immersion coating solution, and then applying plating to said electrode, wherein said first zinc immersion coating solution at least contains a zinc compound, an alkali hydroxide, an iron salt, a chelating agent for complexation of iron ions, and a zinc immersion coating inhibitor, wherein said zinc immersion coating inhibitor is at least one out of the group consisting of a polymer of a secondary amine, a polymer of a tertiary amine, and a polymer of a quaternary amine, or a copolymer containing the same, and said second zinc immersion coating solution at least contains a zinc compound, an alkali hydroxide, an iron salt, a chelating agent for complexation of iron ions, and a zinc immersion coating inhibitor, wherein said zinc immersion coating inhibitor is at least one out of the group consisting of a primary amine, a secondary amine, and a tertiary amine.