Resin compositions, resin molded articles, processes for preparing resin molded articles, and laser direct structuring additives
AssigneeMitsubishi Engineering-Plastics Corporation
InventorsTatsuya KIKUCHI, Ryusuke YAMADA, Yasushi YAMANAKA
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Abstract
Provided is a resin composition having higher platability. The resin composition contains at least two kinds of metals and also containing a conductive oxide having a resistivity of 5×103 Ω·cm or less.
Claims21
1-22. (canceled)
A resin composition comprising a thermoplastic resin, and a laser direct structuring additive containing at least two kinds of metals and also containing a conductive oxide having a resistivity of 5×103 Ω·cm or less.
A laser direct structuring additive comprising a conductive oxide having a resistivity of 5×103 Ω·cm or less, which contains at least a metal of Group n, wherein n is an integer of 3 to 16, and a metal of Group n+1 of the periodic table, wherein an amount of one of the metal of Group n, wherein n is an integer of 3 to 16, and the metal of Group n+1 of the periodic table contained in the laser direct structuring additive is 15 mol % or less provided that the total amount of the metals is 100 mol %.
Dependencies are inferred from the claim text.