Cyanate resin composition and use thereof
AssigneeShengyi Technology Co., Ltd.
InventorsJunqi TANG, Yongjing XU
Life of this patent
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Abstract
The present invention relates to a cyanate resin composition, and a prepreg, a laminate, a metal foil clad laminate and a printed circuit board prepared by using same. The cyanate resin composition comprises a cyanate resin (A), an epoxy resin (B) with a structure of formula (I) and a maleimide compound (C). The cyanate resin composition of the present invention, and the prepreg, the laminate and the metal foil clad laminate prepared by using the cyanate resin composition have good moisture resistance, heat resistance, flame retardancy and reliability, and are suitable for being used as a substrate material for manufacturing a high-density printed circuit board.
Claims29
A cyanate resin composition, characterized in that the cyanate resin composition comprises a cyanate resin (A), an epoxy resin (B) with a structure of formula (I) and a maleimide compound (C)
- wherein R1 is selected from the group consisting of phenyl and naphthyl, and the molar ratio of naphthyl/(naphthyl+phenyl) ranges from 0.05 to 0.95;
- R is aryl;
- n is an integer of 1-20.
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Dependencies are inferred from the claim text.