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US 2016/0108205 A1Published application
Polyamide resin composition and molded article
AssigneeAsahi Kasei Chemicals Corporation
InventorsKazunori TERADA, Teruaki SAKUMA
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Abstract
A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and an amphoteric compound and/or a basic compound (D).
Claims20
A polyamide resin composition comprising:
- a polyamide resin (A),
- a copper compound (B),
- a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and
- an amphoteric compound and/or a basic compound (D).
1 more element
Dependencies are inferred from the claim text.