Methods for forming vias in glass substrates
AssigneeCorning Incorporated
InventorsRobert Carl Burket, Uta-Barbara Goers, Samuel Odei Owusu, Tammy Lynn Petriwisky
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Abstract
Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.
Claims11
1-20. (canceled)
A method of forming a via in a glass substrate, the method comprising:
- laser drilling the via through at least a portion of a thickness of the glass substrate, wherein the via is laser drilled through the glass substrate from an incident surface of the glass substrate;
- etching the glass substrate for an etching duration, thereby increasing a diameter of an incident opening of the via;
- and
- applying ultrasonic energy to the glass substrate during at least a portion of the etching duration, wherein the ultrasonic energy has a first frequency and a second frequency.
A method of forming a via in a glass substrate, the method comprising:
- laser drilling the via through at least a portion of a thickness of the glass substrate, wherein the via is laser drilled through the glass substrate from an incident surface of the glass substrate;
- etching the glass substrate for an etching duration, thereby increasing a diameter of an incident opening of the via;
- and
- applying ultrasonic energy to the glass substrate during at least a portion of the etching duration, wherein the ultrasonic energy is centered about a primary frequency and dithered or swept above and below the primary frequency.
Dependencies are inferred from the claim text.