Methodology and system for wafer-level testing of mems pressure sensors
AssigneeFreescale Semiconductor, Inc.
InventorsBRUNO J. DEBEURRE, PETER T. JONES, WILLIAM D. MCWHORTER, RAIMONDO P. SESSEGO
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AssigneeFreescale Semiconductor, Inc.
InventorsBRUNO J. DEBEURRE, PETER T. JONES, WILLIAM D. MCWHORTER, RAIMONDO P. SESSEGO
Estimating the term…
A method for testing a plurality of pressure sensors on a device wafer includes placing a diaphragm of one of the pressure sensors on the device wafer in proximity to a nozzle of a test system. A pneumatic pressure stimulus is applied to the diaphragm via an outlet of the nozzle and a cavity pressure is measured within a cavity associated with the pressure sensor in response to application of the pneumatic pressure stimulus. The pneumatic pressure stimulus within the cavity corresponds to the pressure applied to the diaphragm. Methodology is executed to test the strength and/or stiffness of the diaphragm. Additionally, the methodology and test system can be utilized to determine an individual calibration factor for each pressure sensor on the device wafer.
A method for testing a plurality of pressure sensors on a device wafer comprising:
A method for testing a plurality of pressure sensors located on a first side of a substrate portion of a device wafer, each of said pressure sensors including a diaphragm and a cavity, said diaphragm being formed in at least one wall surrounding said cavity, and said method comprises:
A test system for testing pressure sensors on a device wafer, each of said pressure sensors including a diaphragm, and said test system comprising:
Dependencies are inferred from the claim text.