Package for a mems sensor and manufacturing process thereof
AssigneeSTMicroelectronics (Malta) Ltd
InventorKevin Formosa
Life of this patent
Estimating the term…
Abstract
A packaged MEMS device, wherein at least two support structures are stacked on each other and are formed both by a support layer and a wall layer coupled to each other and delimiting a respective chamber. The chamber of the first support structure is upwardly delimited by the support layer of the second support structure. A first and a second dice are accommodated in a respective chamber, carried by the respective support layer of the first support structure. The support layer of the second support structure has a through hole allowing wire connections to directly couple the first and the second dice. A lid substrate, coupled to the second support structure, closes the chamber of the second support structure.
Claims20
A device, comprising:
- a first substrate;
- a second substrate attached to the first substrate;
- a first chamber formed between the first substrate and the second substrate;
- a first die in the first chamber;
- a third substrate attached to the second substrate;
- a second chamber formed between the third substrate and the second substrate;
- and
- a second die positioned in the second chamber.
A method, comprising:
- forming a first chamber between the first substrate and the second substrate by attaching a first substrate to a second substrate;
- positioning a first die in the first chamber;
- forming a second chamber formed between the third substrate and the second substrate by attaching a third substrate to the second substrate;
- and
- positioning a second die in the second chamber.
A system, comprising:
- a processor;
- memory coupled to the processor;
- a device coupled to the processor, the device including:
- a first substrate;
- a second substrate attached to the first substrate;
- a first chamber formed between the first substrate and the second substrate;
- a first die in the first chamber;
- a third substrate attached to the second substrate;
- a second chamber formed between the third substrate and the second substrate;
- and
- a second die positioned in the second chamber.
Dependencies are inferred from the claim text.