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US 2016/0107483 A1Published application
Polymer film
AssigneeKolon Industries, Inc.
InventorsYoung-Han JEONG, So-Yeon KWON, II CHUNG, Hyun NAMGOONG
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Abstract
There is provided a polymer film which includes: a base film layer including a polyamide-based resin having a particular relative viscosity and a copolymer including a polyamide-based segment and a polyether-based segment having a specific content; and an adhesive layer formed on at least one side of the base film layer, wherein a ratio of the melt viscosity of the copolymer to the melt viscosity of the polyamide resin is 0.65 to 1.2 at a shear rate of 1000 s−1 and a temperature of 260° C.
Claims17
A polymer film which comprises:
- a base film layer comprising a polyamide-based resin having a relative viscosity (96% sulfuric acid solution) of 3.0 to 3.5 and a copolymer comprising a polyamide-based segment and a polyether-based segment;
- and
- an adhesive layer formed on at least one side of the base film layer and containing resorcinol-formalin-latex (RFL)-based adhesive,
- wherein a content of the polyether-based segment of the copolymer is more than 2% by weight and less than 15% by weight with respect to the total weight of the base film layer, and
- wherein a ratio of a melt viscosity of the copolymer to a melt viscosity of the polyamide resin is 0.60 to 1.2 at a shear rate of 1000 s−1 and a temperature of 260° C.
2 more elements
Dependencies are inferred from the claim text.