Microfluidic delivery member with filter and method of forming same
AssigneesSTMicroelectronics S.r.l., STMicroelectronics Asia Pacific Pte Ltd
InventorsSimon Dodd, Joe Scheffelin, Dana Gruenbacher, Roberto Brioschi, Teck Khim Neo, Dave Hunt, Faiz Sherman
Life of this patent
Estimating the term…
Abstract
Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
Claims20
A method comprising:
- applying adhesive material to a first surface of a printed circuit board strip;
- securing a plurality of filters to the first surface of the printed circuit board strip using the adhesive material, the plurality of filters covering a plurality of through holes, respectively, in the printed circuit board;
- applying adhesive material to a second surface of the printed circuit board strip;
- and
- securing a plurality of semiconductor dice to the second surface of the printed circuit board strip, the plurality of semiconductor dice covering the plurality of through holes, respectively, the plurality of semiconductor dice including an inlet path in fluid communication with the plurality of through holes, respectively, and having nozzles for expelling a fluid.
A method comprising:
- forming a through hole in a printed circuit board, the through hole extending from a first surface of the printed circuit board to a second surface of the printed circuit board;
- coupling a filter to the first surface of the printed circuit board over the through hole;
- and
- coupling a semiconductor die to the filter, the semiconductor die including an inlet path, wherein upon coupling the filter and coupling the semiconductor die, the inlet path of the semiconductor die is located over the through hole in the printed circuit board.
A method comprising:
- coupling a liner to surfaces of a through hole in the printed circuit board;
- coupling a filter to a first surface of the printed circuit board over the through hole;
- and
- coupling a semiconductor die to a second surface of the printed circuit board, the semiconductor die including an inlet path that covers the through hole of the printed circuit board, the semiconductor die further including a plurality of nozzles in fluid communication with the inlet path.
Dependencies are inferred from the claim text.