Pressure-sensitive adhesive film for laser beam cutting applications
AssigneesNitto Europe N.V., Nitto Denko Corporation
InventorsBart FORIER, Donald PINXTEN, Minoru HANAOKA
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Abstract
The present invention provides pressure-sensitive adhesive films with a favourable visual appearance and surface printability without discoloration and burrs on the cutting edge after short-wavelength laser machining. At the same time, the PSA films of the present invention exhibit a favourable cuttability, allowing for high fiber laser as well as carbon dioxide laser cutting speeds. Since the use of the PSA films of the present invention as surface protecting films does not require extensive cleaning and polishing operations after the cutting process and the cutting process itself may be accelerated, the efficiency of laser machining methods may be improved.
Claims8
A pressure-sensitive adhesive film comprising a white resin film as a substrate and a pressure-sensitive adhesive layer provided at least on a face of the resin film, wherein:
- the resin film has a laser beam absorbance in the wavelength range of 1000 nm to 1100 nm of at least 0% and lower than 55%, a laser beam transmittance in the wavelength range of 1000 nm to 1100 nm of more than 5%, and a laser beam reflectance in the wavelength range of 1000 nm to 1100 nm of higher than 40%.
Dependencies are inferred from the claim text.