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US 2016/0107267 A1Published application
Solder alloy
AssigneeAlpha Metals, Inc.
InventorsAnthony Ingham, Gerard Campbell, Brian G. Lewis, Bawa Singh, John P. Laughlin, Ranjit Pandher
Life of this patent
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Abstract
An alloy suitable for use in a wave solder process, hot air levelling process, a ball grid array or chip scale package comprising no more than 3 wt.% bismuth, from 0.15-1.5 wt.% copper, from 0.1-1.5 wt.% silver, and the balance tin, with optionally other alloying elements in certain embodiments, together with unavoidable impurities.
Claims13
An alloy suitable for use in a wave solder process, hot air levelling process, a ball grid array or chip scale package, the alloy comprising
- bismuth in a content that does not exceed 3 wt %,
- from 0.15-1.5 wt. % copper,
- from 0.1-1.5 wt. % silver,
- from 0-0.1 wt. % phosphorus,
- from 0-0.1 wt. % germanium,
- from 0-0.1 wt. % gallium,
- from 0-0.3wt. % of one or more rare earth elements,
- from 0-0.3 wt. % indium,
- from 0-0.3 wt. % magnesium,
- from 0-0.3 wt. % calcium,
- from 0-0.3 wt. % silicon,
- from 0-0.3 wt. % aluminium,
- from 0-0.3 wt. % zinc,
- and at least one of the following elements
- from 0.02-0.3 wt % nickel,
- from 0.008-0.2 wt % manganese,
- from 0.01-0.3 wt % cobalt,
- from 0.01-0.3 wt % chromium,
- from 0.02-0.3 wt % iron, and
- from 0.008-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.
17 more elements
Dependencies are inferred from the claim text.