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US 2016/0107183 A1Published application
Application of Fluids to Substrates
AssigneeInfineon Technologies AG
InventorsKarl Pilch, Hans Leitner, Michael Kalin
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Abstract
Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.
Claims10
An apparatus comprising:
- a substrate holder;
- a fluid application device configured to apply a fluid to a substrate on the substrate holder;
- a heating mechanism configured to locally heat the fluid;
- and
- a controller configured to control the heating mechanism to apply a local heating in order to obtain a desired thickness profile of the fluid on the substrate.
2 more elements
Dependencies are inferred from the claim text.