Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages
AssigneeIntel Corporation
InventorsHenry C. Bosak, Thomas A. Boyd, Harvey R. Kofstad
Life of this patent
Estimating the term…
Abstract
Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed.
Claims21
A heat removal assembly comprising:
- two or more surfaces to thermally couple with respective surfaces of two or more dies;
- and
- bellows to automatically adjust a position of at least one surface of the two or more surfaces relative to another surface of the two or more surfaces.
A multi-chip package assembly that includes a first die and a second die mounted on a package substrate, wherein the first die has a height that is greater or less than a height of the second die relative to a surface of the package substrate;
- and
- a heat removal assembly coupled with the first die and the second die, the heat removal assembly comprising:
- a first surface and a second surface to thermally couple with respective surfaces of the first die and the second die;
- and
- bellows to automatically adjust a position of the first surface or the second surface based on the height of the first die or the second die.
A system comprising:
- a circuit board;
- a plurality of dies coupled with the circuit board;
- and
- a heat removal assembly coupled with a first die and a second die of the plurality of dies, the heat removal assembly comprising:
- a first surface and a second surface to thermally couple with respective surfaces of two of the plurality of dies;
- and
- bellows to automatically adjust a position of the first surface respective to the second surface based on a height of the first die relative to a height of the second die measured from the circuit board.
Dependencies are inferred from the claim text.