Thermal interposer suitable for electronic modules
AssigneeMolex Incorporated
InventorChristopher D. Wanha
Life of this patent
Estimating the term…
Abstract
A thermal interposer for use in providing a mating interface between a heat sink and an electronic module includes an elongated body portion having two opposing surfaces. On one surface, a plurality of press-fit pegs are defined that extend upwardly and outwardly away from the interposer body portion. On the other, opposing surface, a plurality of contact arms are defined that extend, in cantilevered fashion, downwardly and away from the interposer body portion. The press-fit pins are configured to enter grooves formed in a heat sink in a manner to form intimate, metal to metal, contact while the contact arms are configured to contact the top surface of an electronic module with reliable normal force.
Claims20
A thermal interposer for providing a thermal interface between a surface of an electronic module and a heat sink, the thermal interposer comprising:
- a body portion, the body portion having opposing first and second sides, the first and second sides configured to respectively contact the electronic module surface and the heat sink, the body portion including a plurality of cantilevered contact arms formed therein, each contact arm including a base portion attached to the body portion and a free end opposite the base portion, the contact arm being bent outwardly away from the first side at an angle thereto, the free end terminating in a contact face for contacting the electronic module surface when installed;
- and
- the body portion further including a plurality of attachment members disposed along the second side thereof, each attachment member extending upward and away from the second side, each attachment member having a base portion and an attachment point opposite the base portion, each attachment member being received within corresponding opposing grooves of the heat sink in a manner wherein the attachment members intimately contact the grooves.
An interposer for providing a thermal interface between a surface of an electronic module and a heat sink, the interposer comprising:
- a body portion, the body portion including a plurality of sides cooperatively defining a perimeter thereof, first and second surfaces extending between opposing sides for respectively contacting an electronic module surface and a heat sink when the interposer is disposed between the electronic module and heat sink, and a plurality of cantilevered contact arms disposed thereon, each contact arm including a base portion attached to the body portion and a free end disposed opposite the base portion, each contact arm being bent away at an angle from the body portion first surface, each contact arm free end terminating in a contact face for contacting the electronic module surface;
- and
- a plurality of attachment members formed as part of the body portion and disposed on the body portion second surface, each attachment member extending away from the body portion second surface in a direction opposite that of the contact arms, and having a base portion at one end joining with the body portion and an attachment point at an opposite end of the attachment member, some of the attachment members being disposed around the perimeter of the interposer body portion and others of the attachment members being disposed on the interposer body portion interior of the interposer body portion perimeter;
- wherein the contact arm base portions and the attachment member base portions are arranged perpendicular to each other to define a plurality of heat transfer paths between the attachment members and the contact arms.
Dependencies are inferred from the claim text.