Integrated assembly for installing integrated circuit devices on a substrate
AssigneeIntel Corporation
InventorsThomas A. BOYD, Michael Z. ECKBLAD
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Abstract
In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described.
Claims30
A method, comprising:
- aligning a first frame and an integrated circuit device, with a second frame carried on a substrate, along a first alignment axis extending from the second frame to the first frame;
- actuating a first biasing device using a first actuator aligned with the first biasing device along the first alignment axis, to bias the first frame toward the second frame along the alignment axis and bias the integrated circuit toward the substrate;
- and
- latching the first and second frames together, aligned with and biased towards each other with the integrated circuit device and the substrate aligned with, and biased toward each other.
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Dependencies are inferred from the claim text.