Fine line 3d non-planar conforming circuit
AssigneeLockheed Martin Corporation
InventorsStephen Gonya, James Sean Eiche, James Patterson, Kenneth R. Twigg
Life of this patent
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AssigneeLockheed Martin Corporation
InventorsStephen Gonya, James Sean Eiche, James Patterson, Kenneth R. Twigg
Estimating the term…
A method of producing a non-planar conforming circuit on a non-planar surface includes creating a first set of conforming layers. The first set of conforming layers is created by applying an oxide dielectric layer to the surface, applying a conductive material layer to the oxide dielectric layer, applying a resist layer to the conductive material layer, patterning the resist layer according to a desired circuit layout, etching the surface to remove exposed conductive material, and stripping the resist layer. The process may be repeated to form multiple layers of conforming circuits with electrical connections between layers formed by blind microvias. The resulting set of conforming layers can be sealed.
A method of producing a non-planar conforming circuit, comprising:
A non-planar conforming circuit, comprising:
A non-planar conforming circuit, comprising:
Dependencies are inferred from the claim text.