Method for producing soft magnetic film laminate circuit board
AssigneeNitto Denko Corporation
InventorsTakashi HABU, Hirofumi EBE
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Abstract
A method for producing a soft magnetic film laminate circuit board having a soft magnetic film laminated on at least one side of a circuit board includes the steps of bringing a soft magnetic thermosetting film containing soft magnetic particles, having a porosity of 15% or more and 60% or less, and in a semi-cured state into contact with the one side of the circuit board and bringing the soft magnetic thermosetting film into a cured state by vacuum hot pressing.
Claims2
A method for producing a soft magnetic film laminate circuit board having a soft magnetic film laminated on at least one side of a circuit board comprising the steps of:
- bringing a soft magnetic thermosetting film containing soft magnetic particles, having a porosity of 15% or more and 60% or less, and in a semi-cured state into contact with the one side of the circuit board and
- bringing the soft magnetic thermosetting film into a cured state by vacuum hot pressing.
Dependencies are inferred from the claim text.