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US 2016/0105967 A1Published application
Embedded board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJae Hoon CHOI, Jung Hyun PARK, Yong Ho BAEK, Hea Sung KIM, Jung Hyun CHO, Il Jong SEO
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Abstract
An embedded board includes an insulating layer and an electronic device embedded in the insulating layer. A first circuit pattern is embedded to contact a bottom surface of the insulating layer, and a second circuit pattern protrudes from the bottom surface of the insulating layer. A via is bonded to the device and the second circuit pattern.
Claims27
An embedded circuit board comprising:
- an insulating layer;
- an electronic device embedded in the insulating layer;
- a first circuit pattern embedded in the insulating layer to contact a bottom surface of the insulating layer;
- a second circuit pattern protruding from the bottom surface of the insulating layer;
- and
- a via bonded to the device and the second circuit pattern.
3 more elements
A method of manufacturing an embedded board, the method comprising steps of:
- forming a first circuit pattern on a carrier board;
- forming a first insulating layer in which a cavity is formed on a top portion of the carrier board;
- placing an electronic device in the cavity;
- forming a second insulating layer on a top portion of the first insulating layer and embedding the electronic device;
- removing the carrier board;
- and
- forming a second circuit pattern which protrudes from a bottom surface of the second insulating layer formed in the cavity and bonding a via to the electronic device and the second circuit pattern.
4 more elements
Dependencies are inferred from the claim text.