Method for Manufacturing a Surface Mount Device
AssigneeTyco Electronics Corporation
InventorsMario G. Sepulveda, Martin G. Pineda, Anthony Vranicar, Kedar V. Bhatawadekar, Minh V. Ngo, Dov Nitzan
Life of this patent
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Abstract
A method of manufacturing a surface mount device includes providing at least one core device and at least one lead frame. The core device is attached to the lead frame. The core device and the lead frame are encapsulated within an encapsulant. The encapsulant comprises a liquid epoxy that when cured has an oxygen permeability of less than approximately 0.4 cm3•mm/m2•atm•day.
Claims20
A method of manufacturing a surface mount device, the method comprising:
- providing at least one core device and at least one lead frame;
- attaching the core device to the lead frame;
- encapsulating at least a portion of the at least one core device and a portion of the at least one lead frame within an encapsulant, wherein the encapsulant comprises a liquid epoxy that when cured has an oxygen permeability of less than about 0.4 cm3•mm/m2•atm•day.
The method according to 5, wherein the first contact pad is in electrical contact with a first end of the core device, and the method further comprises providing at least one conductor that wraps around one side of the core device to thereby electrically couple the second contact pad to a second end of the core device.
A surface mount device comprising:
- a core device;
- a portion of a lead frame attached to the core device;
- and
- an encapsulant surrounding at least a portion of the core device and a portion the lead frame, wherein the encapsulant corresponds to a cured version of a liquid epoxy and has an oxygen permeability of less than approximately 0.4 cm3•mm/m2•atm•day.
The surface mount device according to 16, wherein the first contact pad is in electrical contact with a first end of the core device, and the surface mount device comprises a conductive clip that wraps around one side of the core device to thereby electrically couple the second contact pad to a second end of the core device.
Dependencies are inferred from the claim text.