Electric circuit and method of manufacture

A method for manufacturing an electric circuit, comprising:

• providing a substrate having a first circuit element receiving area, a first interconnect, and a second interconnect, the first interconnect spaced apart from the second interconnect, wherein the first interconnect has a first surface and the second interconnect has a second surface;
• forming a first dimple in the first interconnect, the first dimple extending from the first surface into the first interconnect;
• and
• coupling a first circuit element to the first interconnect with a bonding agent, wherein a portion of the bonding agent settles in the first dimple.

An electric circuit, comprising:

• a support having a first circuit element receiving area, a first interconnect, a second interconnect, and a first notch, the first interconnect spaced apart from the second interconnect, wherein the first interconnect has a first surface and the second interconnect has a second surface, and wherein the first notch extends from the first surface into the first interconnect;
• a first circuit element coupled to the first interconnect by a bonding agent, a portion of the bonding agent in the first notch;
• and
• a protective structure encapsulating at least a portion of the first interconnect, at least a portion of the second interconnect, and the first circuit element.