Multi-layer substrate, electronic device using multi-layer substrate, manufacturing method for multilayer substrate, substrate, and electronic device using substrate

A method of manufacturing a multi-layer substrate, comprising:

• preparing a core layer having a front surface, and including an inner layer wire on the front surface;
• preparing a build-up layer having a glass cloth and a resin layer on both surfaces of the glass cloth, the resin layer having the same thickness on both of the surfaces of the glass cloth;
• laminating the build-up layer on the front surface of the core layer;
• laminating a metal plate on a surface of the build-up layer opposite to the core layer;
• deforming a portion of the glass cloth corresponding to the inner layer wire in a direction away from the core layer so that the portion of the glass cloth is extruded toward the metal plate by the inner layer wire than a portion of the glass cloth without corresponding to the inner layer wire while allowing a resin forming the resin layer of the build-up layer to flow around the inner layer wire by heating a laminated body having the core layer, the build-up layer, and the metal plate while pressurizing the laminated body in a laminating direction;
• and
• forming a surface layer wire in a portion of the metal plate corresponding to the inner layer wire by patterning the metal plate.

A substrate comprising:

• an insulating layer;
• a first conductor arranged on one side of the insulating layer in a thickness direction of the insulating layer;
• and
• a second conductor arranged on the other side of the insulating layer in the thickness direction, wherein
• the insulating layer includes a glass cloth, and a resin layer that is made of an electrically insulating resin material, and seals a surface of the glass cloth adjacent to the first conductor and a surface of the glass cloth adjacent to the second conductor,
• a linear expansion coefficient of the glass cloth is lower than a linear expansion coefficient of the first conductor, and lower than a linear expansion coefficient of a portion of the resin layer disposed adjacent to the first conductor,
• a dimension between the first conductor and the glass cloth in the thickness direction of the insulating layer is defined as A, a dimension of the glass cloth in the thickness direction is defined as B, and a dimension between a surface (230b, 240b) of the insulating layer adjacent to the second conductor and the glass cloth in the thickness direction is defined as C, and
• A, B, and C satisfy a size relationship of C>A>B.