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US 2016/0105956 A1Published application
Printed circuit board and method of fabricating the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJun Oh HWANG, Kwang Hee KWON, Seung Eun LEE, Young Kwan LEE, Yul Kyo CHUNG, Se Rang IM, Ki Jung SUNG
Life of this patent
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Abstract
The present invention provides a printed circuit board includes an insulating member, a first plating layer buried in a bottom region of the insulating member, a second plating layer buried in a top region of the insulating member and a plating via for electrically connecting the first plating layer and the second plating layer by being buried in any one among the top region and the bottom region of the insulating member.
Claims14
A printed circuit board comprising:
- an insulating member;
- a first plating layer buried in a bottom region of the insulating member;
- a second plating layer buried in a top region of the insulating member;
- and
- a plating via for electrically connecting the first plating layer and the second plating layer by being buried in any one among the top region and the bottom region of the insulating member.
2 more elements
A method of fabricating a printed circuit board comprising:
- patterning a first insulating member;
- stacking a resist pattern on the first insulating member;
- plating metal material between patterns of the first insulating member and between the resist patterns;
- delaminating the resist pattern;
- and
- coating the second insulating member on the first insulating member.
3 more elements
Dependencies are inferred from the claim text.