Printed circuit board and display device
AssigneeShenzhen China Star Optoelectronics Technology Co., Ltd.
InventorJianyong Fu
Life of this patent
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Abstract
A printed circuit board and a display device are provided. The printed circuit board comprises a substrate, a package chip, and a metal heat dissipation layer. The package chip is disposed on a first surface of the substrate and comprises a chip body. The metal heat dissipation layer is disposed on a second surface of the substrate. A projection of the metal heat dissipation layer on the first surface of the substrate covers the chip body. The metal heat dissipation layer of the present invention is disposed on the reverse side of the printed circuit board to reduce the temperature of the package chip.
Claims20
A printed circuit board, comprising:
- a substrate comprising a first surface and a second surface opposite the first surface;
- a package chip disposed on the first surface of the substrate and comprising a chip body and a plurality of pins;
- and
- a metal heat dissipation layer disposed on the second surface;
- wherein a projection of the metal heat dissipation layer on the first surface of the substrate covers the chip body, and an area of the metal heat dissipation layer is greater than or equal to an area of the chip body, and a plurality of through holes are disposed on the substrate corresponding to the metal heat dissipation layer.
A printed circuit board, comprising:
- a substrate comprising a first surface and a second surface opposite the first surface;
- a package chip disposed on the first surface of the substrate and comprising a chip body and a plurality of pins;
- and
- a metal heat dissipation layer disposed on the second surface;
- wherein a projection of the metal heat dissipation layer on the first surface of the substrate covers the chip body.
A display device comprising at least one printed circuit board, wherein the printed circuit board comprises:
- a substrate comprising a first surface and a second surface opposite the first surface;
- a package chip disposed on the first surface of the substrate and comprising a chip body and a plurality of pins;
- and
- a metal heat dissipation layer disposed on the second surface;
- wherein a projection of the metal heat dissipation layer on the first surface of the substrate covers the chip body.
Dependencies are inferred from the claim text.