Packages and methods for packaging
AssigneeAnalog Devices, Inc.
InventorsOliver J. Kierse, Christian Lillelund
Life of this patent
Estimating the term…
Abstract
A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.
Claims21
(canceled)
An integrated device package comprising:
- a housing defining a cavity, the housing comprising:
- a non-conductive base;
- a non-conductive wall extending from the base;
- and
- a conductor monolithically integrated with the non-conductive base, wherein the conductor comprises a first material and the base comprises a second material, wherein the conductor and the base are joined along a boundary surface such that portions of the first material are mixed together with portions of the second material, wherein the conductor and the base are joined along the boundary surface such that most of the first material is disposed on a first side of the boundary surface and most of the second material is disposed on a second side of the boundary surface, and wherein at least a portion of the second material is disposed on the first side of the boundary surface;
- an integrated device die mounted to and electrically connected to the housing, the integrated device die disposed in the cavity;
- and
- an electrical lead disposed on an outer surface of the housing.
An integrated device package comprising:
- a housing defining a cavity, the housing comprising:
- a non-conductive base;
- a non-conductive wall extending from the base;
- and
- a conductor monolithically integrated with the non-conductive base by a three-dimensional (3D) printing technique;
- an integrated device die mounted to and electrically connected to the housing, the integrated device die disposed in the cavity;
- and
- an electrical lead disposed on an outer surface of the housing.
An integrated device package comprising:
- a housing defining a cavity, the housing comprising:
- a non-conductive base;
- a non-conductive wall extending from the base;
- and
- a conductor monolithically integrated with the non-conductive wall, wherein the conductor comprises a first material and the wall comprises a second material, wherein the conductor and the wall are joined along a boundary surface such that portions of the first material are mixed together with portions of the second material, wherein the conductor and the wall are joined along the boundary surface such that most of the first material is disposed on a first side of the boundary surface and most of the second material is disposed on a second side of the boundary surface, and wherein at least a portion of the second material is disposed on the first side of the boundary surface;
- an integrated device die mounted to and electrically connected to the housing, the integrated device die disposed in the cavity;
- and
- an electrical lead disposed on an outer surface of the housing.
Dependencies are inferred from the claim text.