On Board Transceiver
AssigneeFCI Asia Pte. Ltd.
InventorUlrich KEIL
Life of this patent
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Abstract
An electrical component assembly includes a substrate and first and second electrical components attached to the substrate and operably connected with each other via the substrate. In use the first electrical component generates a first amount of heat and the second component generates a second amount of heat. The first component is thermally connected with a heat sink along a first heat path and the second component is connected with the heat sink along a second, different, heat path, such that the thermal conductivity between the first and second components is lower than the thermal conductivity of the first heat path and of the second heat path.
Claims16
An electrical component assembly comprising a substrate and first and second electrical components attached to the substrate and operably connected with each other via the substrate,
- wherein in use the first electrical component generates a first amount of heat and the second component generates a second amount of heat,
- wherein the first component is thermally connected with a heat sink along a first heat path and the second component is connected with the heat sink along a second, different, heat path,
- such that the thermal conductivity between the first and second components is lower than the thermal conductivity of the first heat path and of the second heat path.
Dependencies are inferred from the claim text.