Bi-directional mosfet cooling for an electric machine

Abstract

A power module for an electric machine. The power module includes a thermally conductive base having opposite first and second surfaces. The first surface is adapted for mounting the power module in conductive thermal communication with a heat sink. A MOSFET superposes the base second surface and is in conductive thermal communication with the base. A MOSFET driver superposes the base second surface and is operatively connected to the MOSFET. The transference from the power module of heat generated by the MOSFET and the MOSFET driver from the power module is directed along a primary cooling path to the heat sink through the base and a secondary cooling path to ambient air. The primary and secondary cooling paths are separate from each other. An electronics package and an electric machine including a power module are also disclosed.

Dependencies are inferred from the claim text.