Wire splicing device, wire splicing method, and method for manufacturing splice structure

A wire splicing method comprising:

• disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween,
• pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder;
• keeping the first wire and the second wire pressed together by the pressing plate;
• separating the heating body from the pressing plate;
• and
• cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

A wire splicing method comprising:

• disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other;
• disposing solder to straddle the first wire and the second wire;
• disposing a connection wire on the solder;
• pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder;
• keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate;
• separating the heating body from the pressing plate;
• and
• cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

A method for manufacturing a splice structure comprising:

• disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween;
• pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder;
• keeping the first wire and the second wire pressed together by the pressing plate, separating the heating body from the pressing plate;
• and
• cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

A method for manufacturing a splice structure comprising:

• disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other;
• disposing solder to straddle the first wire and the second wire;
• disposing a connection wire on the solder;
• pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder;
• keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate,
• separating the heating body from the pressing plate;
• and
• cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.