Power Module, Power Converter and Drive Arrangement With A Power Module

A power converter configured to supply at least one phase current for an electrical machine, the power converter comprising:

• a power module comprising:
• a first busbar having a first surface and a second surface opposite the first surface,
• a first semiconductor component on the first surface of the first busbar, wherein said first semiconductor component comprises a first surface with a first electrical surface contact terminal, and wherein said first semiconductor component comprises is connected in an electrically conductive, flat and mechanical manner via the first surface contact terminal to the first surface of the first busbar, and
• a second semiconductor component on the second surface of the first busbar, wherein said second semiconductor component comprises a first surface with a first electrical surface contact terminal, and wherein said second semiconductor component is connected in an electrically conductive, flat and mechanical manner via the first surface contact terminal of the second semiconductor component to the second surface of the first busbar.

A drive arrangement for driving a vehicle with an electrical machine, the drive arrangement comprising:

• a power converter for supplying at least one phase current for an electrical machine, the power converter comprising:
• a power module comprising:
• a first busbar having a first surface and a second surface opposite the first surface,
• a first semiconductor component on the first surface of the first busbar, wherein said first semiconductor component comprises a first surface with a first electrical surface contact terminal, and wherein said first semiconductor component comprises is connected in an electrically conductive, flat and mechanical manner via the first surface contact terminal to the first surface of the first busbar, and
• a second semiconductor component on the second surface of the first busbar, wherein said second semiconductor component comprises a first surface with a first electrical surface contact terminal, and wherein said second semiconductor component is connected in an electrically conductive, flat and mechanical manner via the first surface contact terminal of the second semiconductor component to the second surface of the first busbar.