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US 2016/0104934 A1Published application
Antenna, antenna package, and communications module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung Goo JANG, Se Min JIN, Eun Kyoung KIM, Min Hoon KIM, Hyung Geun JI, Jae Hyun CHANG
Life of this patent
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Abstract
An antenna includes: a board including layers; a main antenna pattern formed on a layer among the layers, and including two main patterns spaced apart from each other; and dummy patterns formed in the board and insulated from the main antenna pattern.
Claims17
An antenna comprising:
- a board comprising layers;
- a main antenna pattern formed on a layer among the layers, and comprising two main patterns spaced apart from each other;
- and
- dummy patterns formed in the board and insulated from the main antenna pattern.
1 more element
An antenna package comprising antennas, wherein each antenna among the antennas comprises:
- a board comprising layers;
- an antenna pattern formed on a layer among the layers and comprising two patterns spaced apart from each other;
- and
- dummy patterns insulated from the antenna pattern.
1 more element
A method of manufacturing an antenna, comprising:
- disposing a main antenna pattern on a layer among layers of a board, the main antenna pattern comprising two main patterns spaced apart from each other;
- and
- disposing dummy patterns in the board, the dummy patterns being insulated from the main antenna pattern.
Dependencies are inferred from the claim text.