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US 2016/0104928 A1Published application
Insulated covered wire and multi-wire wiring board
AssigneeHitachi Chemical Company, Ltd.
InventorsHiroyuki YAMAGUCHI, Haruo OGINO, Seiichi KURIHARA
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Abstract
The present invention provides an insulated coated wire comprising a wire, a wire coating layer disposed around the wire, and a wire adhesive layer disposed around the wire coating layer, wherein the wire coating layer is of one type of or a combination of two or more types of a fluorine resin, a polyamide-imide resin and a low dielectric polyimide resin having a relative permittivity of less than 3.6 at 10 GHz, and a multi-wire wiring board using the insulated coated wire.
Claims5
An insulated coated wire comprising:
- a wire;
- a wire coating layer disposed around the wire;
- and
- a wire adhesive layer disposed around the wire coating layer,
- wherein the wire coating layer is of one type of or a combination of two or more types of a fluorine resin, a polyamide-imide resin and a low dielectric polyimide resin having a relative permittivity of less than 3.6 at 10 GHz.
2 more elements
Dependencies are inferred from the claim text.