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AssigneeEverDisplay Optronics (Shanghai) Limited
InventorsMaochung LIN, Pochun HSIEH, Liangjui CHANG, Xinran SUN
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The present disclosure discloses a packaging structure and a manufacturing method thereof, and a display panel. The packaging structure includes: a sintering part, formed between the substrate and the cover plate, wherein an encapsulation space is formed by the sintering part, the cover plate and the substrate, and the light emitting display unit is formed in the encapsulation space; and a protection part, formed on the cover plate, wherein the sintering part partially contacts with the protection part and partially contact with the cover plate. The present disclosure provides a protection part between the sintering part and the cover plate, the sintering part is divided into non-sintering regions and sintering regions by the protection part which covers a part of regions of the sintering part, thus reducing high temperature and stress generated in the process of laser sintering.
A packaging structure for sealing a display panel, the display panel comprising a substrate, a cover plate, and a light emitting display unit provided on a surface of the substrate, the packaging structure comprising:
A manufacturing method for a packaging structure, the packaging structure being used for sealing a display panel, the display panel comprising a substrate, a cover plate, and a light emitting display unit provided on a surface of the substrate, the manufacturing method comprising:
A display panel, comprising a substrate, a cover plate, and a light emitting display unit provided on a surface of the substrate, wherein, the display panel further comprises a packaging structure, and the packaging structure comprises:
Dependencies are inferred from the claim text.