Light emitting device package
AssigneeLG Innotek Co., Ltd.
InventorsJun Seok PARK, Wan Ho KIM
Life of this patent
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Abstract
A light emitting device package is provided. The light emitting device package includes a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.
Claims38
A semiconductor light emitting device package, comprising:
- a package body;
- a first cavity and a second cavity underneath the first cavity on the package body;
- a first lead electrode on the second cavity;
- a second lead electrode spaced apart from the first lead electrode;
- and
- a light emitting device on the first lead electrode,
- wherein a bottom of the second cavity comprises an opening through the package body,
- wherein the first lead electrode comprises a bottom portion exposed through the opening, and
- wherein a bottom surface of the first lead electrode exposed through the opening is substantially flush with a bottom surface of the second cavity.
A semiconductor light emitting device package, comprising:
- a package body;
- a first cavity and a second cavity underneath the first cavity on the package body;
- a first lead electrode on the second cavity;
- a second lead electrode spaced apart from the first lead electrode;
- a light emitting device on the first lead electrode;
- a phosphor layer disposed in the second cavity;
- and
- a resin layer disposed in the first cavity,
- wherein a bottom of the second cavity comprises an opening through the package body,
- wherein the first lead electrode comprises a bottom portion exposed through the opening, and
- wherein a bottom surface of the first lead electrode exposed through the opening is substantially flush with a bottom surface of the second cavity.
30-36. (canceled)
Dependencies are inferred from the claim text.