Semiconductor light emitting device and method for manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorHideto FURUYAMA
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Abstract
According to one embodiment, a semiconductor light emitting device includes a light emitting element, a fluorescent material layer, and an inorganic material layer. The light emitting element has an asperity surface. The fluorescent material layer is provided on the asperity surface. The fluorescent material layer has a glass member and a fluorescent material dispersed in the glass member. The inorganic material layer is provided between the asperity surface and the fluorescent material layer. The inorganic material layer is in contact with the asperity surface and the fluorescent material layer, and transmissive to light emitted from the light emitting element.
Claims20
A semiconductor light emitting device comprising:
- a light emitting element having an asperity surface;
- a fluorescent material layer provided on the asperity surface, the fluorescent material layer having a glass member and a fluorescent material dispersed in the glass member;
- and
- an inorganic material layer provided between the asperity surface and the fluorescent material layer, the inorganic material layer being in contact with the asperity surface and the fluorescent material layer, and transmissive to light emitted from the light emitting element.
A method for manufacturing a semiconductor light emitting device comprising:
- forming an inorganic material layer transmissive to light emitted from a light emitting element on an asperity surface of the light emitting element;
- smoothening a surface of the inorganic material layer;
- and
- bonding a fluorescent material layer having at least a glass member and a fluorescent material dispersed in the glass member to the smoothened surface of the inorganic material layer.
A method for manufacturing a semiconductor light emitting device comprising:
- forming a first inorganic material layer transmissive to light emitted from a light emitting element on an asperity surface of the light emitting element;
- smoothening a surface of the first inorganic material layer;
- forming a second inorganic material layer transmissive to light emitted from the light emitting element on a surface of a fluorescent material layer having a glass member and a fluorescent material dispersed in the glass member;
- smoothening a surface of the second inorganic material layer;
- and
- bonding the smoothened surface of the first inorganic material layer and the smoothened surface of the second inorganic material layer together.
Dependencies are inferred from the claim text.