Method for the production of a wavelength conversion element, wavelength conversion element, and component comprising the wavelength conversion element
AssigneeOSRAM Opto Semiconductors GmbH
InventorsBritta GOEOETZ, Martin BRANDL, Markus BURGER, Norwin VON MALM
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Abstract
Disclosed is a method for producing a wavelength conversion element (10) wherein a wavelength conversion layer (100) is provided, the surface thereof is treated with a plasma (50), and the wavelength conversion layer is punched. Also disclosed are a wavelength conversion layer and an optoelectronic component comprising a wavelength conversion layer.
Claims17
A method for producing a wavelength conversion element, having the method steps:
- A) providing a wavelength conversion layer having a first surface and a second surface opposite the first surface, the second surface being arranged on a carrier layer,
- B) treating the first surface with a plasma,
- C) stamping at least the wavelength conversion layer, wherein at least one wavelength conversion element having a first surface and an opposite second surface is obtained.
A wavelength conversion element comprising a first surface and a second surface opposite the first surface, wherein the wavelength conversion element comprises a glass starting from the first surface and/or the second surface in a vertical direction as far as a penetration depth, and beyond the penetration depth comprises a material which is stickier than the glass material.
An optoelectronic component comprising a radiation-emitting semiconductor chip and a wavelength conversion element according to one of the preceding claims, which is arranged with the first surface or the second surface on the semiconductor chip in the beam path of the semiconductor chip.
Dependencies are inferred from the claim text.