Led package

A light emitting diode (LED) package, comprising:

• a first frame and a second frame insulated with the first frame;
• an LED die mounted on and electrically connected to the first frame and the second frame, the LED die comprising:
• a substrate;
• an N type semiconductor layer, an active layer, and a P type semiconductor layer formed on the substrate in sequence;
• at least one recess penetrating through the P type semiconductor layer and the active layer and extending to the N type semiconductor layer;
• an insulating layer covering the all of side surfaces of the N type semiconductor layer, the active layer, the P type semiconductor layer, and covering top of the P type semiconductor layer except an opening on the P semiconductor layer;
• and
• a pair of electrodes, one of the electrodes filled in the recess and electrically connected to the N type semiconductor layer, and the other one of the electrodes connected to the P type semiconductor layer in the opening.

A method for manufacturing a light emitting diode (LED) package, comprising:

• providing an LED die including a substrate, an N type semiconductor layer, an active layer, and a P type semiconductor layer grown on the substrate in sequence;
• etching the N type semiconductor layer, the active layer and the P type semiconductor layer to define a plurality of recesses and a groove;
• forming an insulating layer to cover side surfaces of the recesses and the P type semiconductor layer;
• etching a portion of the insulating layer to define an opening to expose a top portion of the P type semiconductor layer;
• forming two spaced electrodes and electrically connecting the electrodes to the N type semiconductor layer and P type semiconductor layer respectively;
• and
• cutting the LED die along the groove to obtain individual LED die.