Image sensor and methods of manufacturing the same

A method of manufacturing an image sensor, the method comprising:

• providing a first substrate having a first surface and a second surface opposed to the first surface, the first substrate being divided into a first region, a second region surrounding the first region, a third region surrounding the second region and a fourth region surrounding the third region;
• forming a photodiode array in the first substrate adjacent to the first surface, the photodiode array including first photodiodes in the first region, second photodiodes in the second region and third photodiodes in the third region;
• forming a first wiring structure in the first region, a second wiring structure in the second region, a third wiring structure in the third region on the first surface of the first substrate, the first wiring structure being electrically connected to the first photodiodes, the second wiring structure including a power supply wiring, and the third wiring structure being electrically connected to the third photodiodes;
• arranging a second substrate to face the first surface of the first substrate, the second substrate supporting the first substrate;
• removing portions of the first substrate adjacent to the second surface;
• and
• forming a light blocking layer pattern on the second surface of the first substrate, the light blocking layer pattern covering the third region and the fourth region.

An image sensor, comprising:

• a first substrate having a first surface and a second surface opposed to the first surface, the first substrate being divided into a first region, a second region surrounding the first region, a third region surrounding the second region and a fourth region surrounding the third region;
• a photodiode array disposed in the first substrate adjacent to the first surface, the photodiode array including first photodiodes in the first region, second photodiodes in the second region and third photodiodes in the third region;
• a first wiring structure disposed in the second region on the first surface of the first substrate, the first wiring structure including a power supply wiring;
• a second wiring structure disposed in the third region on the first surface of the first substrate, the second wiring structure being electrically connected to the third photodiodes;
• a third wiring structure disposed in the second region on the first surface of the first substrate, the third wiring structure including a power supply wiring;
• a light blocking layer pattern disposed on the second surface of the first substrate, the light blocking layer pattern covering the third region and the fourth region.