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US 2016/0104739 A1Published application
Manufacturing method for semiconductor device and semiconductor device
AssigneeCanon Kabushiki Kaisha
InventorHideomi Kumano
Life of this patent
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Abstract
A step of forming a connecting member configured to electrically connect a first conductive line and a second conductive line includes a phase of perforating a laminate from a first semiconductor wafer to form a plurality of connection holes that reach the second conductive line and a phase of filling the plurality of penetrating connection holes with a conductive material to form conductive sections in contact with the second conductive line.
Claims20
A semiconductor device comprising:
- a first semiconductor substrate;
- a second semiconductor substrate;
- a first wiring section arranged between the first semiconductor substrate and the second semiconductor substrate;
- a second wiring section arranged between the first semiconductor substrate and the second semiconductor substrate;
- and
- a connecting member configured to electrically connect the first wiring section and the second wiring section,
- wherein the connecting member comprises at least one of a plurality of conductive sections provided through the first semiconductor substrate and in contact with the first wiring section and a plurality of conductive sections provided through the first semiconductor substrate and in contact with the second wiring section.
4 more elements
Dependencies are inferred from the claim text.