Image sensing device with interconnect layer gap and related methods
AssigneeStmicroelectronics Pte Ltd
InventorJing-En LUAN
Life of this patent
Estimating the term…
Abstract
An image sensing device may include an interconnect layer, an image sensor IC coupled to the interconnect layer and having an image sensing surface, and an IR filter aligned with the image sensing surface opposite the interconnect layer. The image sensing device may include a flexible interconnect layer aligned with the interconnect layer and having a flexible substrate extending laterally outwardly from the interconnect layer, and electrically conductive traces on the flexible substrate. The image sensing device may also include solder bodies coupling the interconnect layer and the flexible interconnect layer and also defining a gap between the interconnect layer and the flexible interconnect layer.
Claims24
An image sensing device comprising:
- an interconnect layer;
- an image sensor integrated circuit (IC) coupled to said interconnect layer and having an image sensing surface opposite said interconnect layer;
- an infrared (IR) filter aligned with the image sensing surface;
- a lens assembly aligned with said IR filter;
- a flexible interconnect layer aligned with said interconnect layer and comprising
- a flexible substrate extending laterally outwardly from said interconnect layer,
- a plurality of electrically conductive traces on said flexible substrate, and
- a connector carried by said flexible substrate and coupled to said plurality of electrically conductive traces;
- and
- a plurality of solder bodies coupling said interconnect layer and said flexible interconnect layer and also defining a gap between said interconnect layer and said flexible interconnect layer.
An image sensing device comprising:
- an interconnect layer;
- an image sensor integrated circuit (IC) coupled to said interconnect layer and having an image sensing surface opposite said interconnect layer;
- an infrared (IR) filter aligned with the image sensing surface;
- a flexible interconnect layer aligned with said interconnect layer and comprising a flexible substrate extending laterally outwardly from said interconnect layer, and a plurality of electrically conductive traces on said flexible substrate;
- and
- a plurality of solder bodies coupling said interconnect layer and said flexible interconnect layer and also defining a gap between said interconnect layer and said flexible interconnect layer.
A method of making an image sensing device comprising:
- positioning an image sensor integrated circuit (IC) coupled to an interconnect layer, the image sensor IC having an image sensing surface opposite the interconnect layer;
- positioning an infrared (IR) filter aligned with the image sensing surface;
- positioning a flexible interconnect layer aligned with the interconnect layer, the flexible interconnect layer comprising a flexible substrate extending laterally outwardly from the interconnect layer, and a plurality of electrically conductive traces on the flexible substrate;
- and
- forming a plurality of solder bodies coupling the interconnect layer and the flexible interconnect layer and also defining a gap between the interconnect layer and the flexible interconnect layer.
Dependencies are inferred from the claim text.