Image sensor device with flexible interconnect layer and related methods

An image sensor device comprising:

• an interconnect layer having an opening extending therethrough;
• an image sensor integrated circuit (IC) within the opening and having an image sensing surface;
• an infrared (IR) filter aligned with the image sensing surface;
• a lens assembly aligned with said IR filter;
• an encapsulation material laterally surrounding said image sensor IC and filling the opening, said encapsulation material extending past said interconnect layer opposite the image sensing surface defining a peripheral portion;
• and
• a flexible interconnect layer coupled to said interconnect layer opposite the image sensing surface, said flexible interconnect layer having an opening therein aligned with the peripheral portion.

A method of making an image sensor device comprising:

• forming an interconnect layer comprising a dielectric layer, and at least one electrical conductor carried internally in the dielectric layer, the interconnect layer to have an opening extending therethrough;
• positioning an image sensor integrated circuit (IC) to be within the opening and have an image sensing surface;
• positioning an infrared (IR) filter to be aligned with the image sensing surface;
• forming an encapsulation material to laterally surround the image sensor IC and fill the opening;
• and
• positioning a flexible interconnect layer to be coupled to the interconnect layer opposite the image sensing surface.