US 2016/0104731 A1 · Semiconductor Device and Method of Forming EWLB Semiconductor Package with Vertical Interconnect Structure and Cavity Region

Abstract

A semiconductor device has a substrate containing a transparent or translucent material. A spacer is mounted to the substrate. A first semiconductor die has an active region and first conductive vias electrically connected to the active region. The active region can include a sensor responsive to light received through the substrate. The first die is mounted to the spacer with the active region positioned over an opening in the spacer and oriented toward the substrate. An encapsulant is deposited over the first die and substrate. An interconnect structure is formed over the encapsulant and first die. The interconnect structure is electrically connected through the first conductive vias to the active region. A second semiconductor die having second conductive vias can be mounted to the first die with the first conductive vias electrically connected to the second conductive vias.

Claims25

Dependent claims

A method of making a semiconductor device, comprising:

providing a substrate including an optical grade material;
disposing a plurality of spacers over a surface of the substrate;
disposing a first semiconductor die over the spacers with an active region of the first semiconductor die oriented toward the substrate and positioned over an opening between the spacers;
depositing an encapsulant around the first semiconductor die;
and
forming an interconnect structure over a surface of the first semiconductor die opposite the active region.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

14/974,002Filed 18 Dec 2015

Priority

31 May 2011

Published

14 Apr 2016

Term ends

Not estimatedThe source records don’t support an estimate.

Classification17 codes

H10F 39/018
Manufacture or treatment of image sensors covered by group H10F39/12: of hybrid image sensors
B81C 1/0023
Integrating an electronic processing unit with a micromechanical structure: packaging together an electronic processing unit die and a…
H10F 39/804
Constructional details of image sensors: containers or encapsulations
H10F 39/809
Constructional details of image sensors: of hybrid image sensors

Semiconductor Device and Method of Forming EWLB Semiconductor Package with Vertical Interconnect Structure and Cavity Region

Life of this patent

Semiconductor Device and Method of Forming EWLB Semiconductor Package with Vertical Interconnect Structure and Cavity Region

Life of this patent

Abstract

Claims25