Techniques for tiling arrays of pixel elements and fabricating hybridized tiles

A hybridized array of semiconductor elements and control circuitry comprising:

• a first electronic component comprising a plurality of individual semiconductor elements on a first substrate;
• a first set of bump contacts disposed on the individual semiconductor elements;
• a second electronic component comprising control circuitry on a second substrate for operating the semiconductor elements;
• and
• a second set of bump contacts on the second substrate;
• wherein:
• the first and second substrates are joined, face-to-face, and the first set of bump contacts is connected with the second set of bump contacts, resulting in a hybridized array of semiconductor elements and control circuitry extending over an area which is smaller than an overall surface area of the first and second substrates and which is singulated from the first and second substrates.

A method of making a hybridized array of semiconductor elements and control circuitry comprising:

• providing a plurality of individual semiconductor elements on a first substrate;
• providing a first set of bump contacts on the individual semiconductor elements;
• providing control circuitry on a second substrate for operating the semiconductor elements;
• providing a second set of bump contacts on the second substrate;
• joining the first and second substrates, face-to-face, and connecting the first set of bump contacts with the second set of bump contacts;
• and
• after joining the first and second substrates, singulating a resulting hybridized array of semiconductor elements and control circuitry from the first and second substrates.