Packaged Semiconductor Devices and Packaging Methods Thereof

A method of packaging semiconductor devices, the method comprising:

• providing a first device;
• coupling a second device to the first device using a plurality of connectors, the second device including an integrated circuit die covered by a molding compound;
• and
• forming an over-mold structure over the second device and around the plurality of connectors, wherein the over-mold structure and the molding compound comprise a same molding compound material, and the over-mold structure is formed to produce a gap region disposed between the first device and the second device, the gap region being substantially free of molding compound material.

A method of packaging semiconductor devices, the method comprising:

• providing a plurality of first integrated circuit dies;
• providing a plurality of second integrated circuit dies, each of the plurality of second integrated circuit dies including a molding compound disposed thereon;
• coupling each of the plurality of second integrated circuit dies to one of the first integrated circuit dies;
• forming an over-mold structure over the plurality of second integrated circuit dies, wherein the over-mold structure and the molding compound comprise a same molding compound material, and the over-mold structure is formed to produce a plurality of regions substantially free of molding compound material between the first integrated circuit dies and the second integrated circuit dies;
• and
• singulating the over-mold structure to form a plurality of packaged semiconductor devices.

A method of packaging semiconductor devices, the method comprising:

• providing a first device;
• coupling a second device to the first device, the second device including an integrated circuit die covered with a molding compound;
• and
• forming an over-mold structure over the second device, wherein the over-mold structure comprises edges defining a gap region disposed between the first device and the second device.