Robust and Reliable Power Semiconductor Package
AssigneeInternational Rectifier Corporation
InventorEung San Cho
Life of this patent
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Abstract
In one implementation, a semiconductor package includes a patterned conductive carrier including a support segment having a partially etched recess. The semiconductor package also includes an integrated circuit (IC) situated on the support segment, and an electrical connector coupling the IC to the partially etched recess. In addition, the semiconductor package includes a packaging dielectric formed over the patterned conductive carrier and the IC. The packaging dielectric interfaces with and mechanically engages the partially etched recess so as to prevent delamination of the electrical connector.
Claims20
A semiconductor package comprising:
- a patterned conductive carrier including a support segment having a partially etched recess;
- an integrated circuit (IC) situated on said support segment;
- an electrical connector coupling said IC to said partially etched recess;
- a packaging dielectric formed over said patterned conductive carrier and said IC, said packaging dielectric interfacing with and mechanically engaging said partially etched recess so as to prevent delamination of said electrical connector.
A method for fabricating a semiconductor package, said method comprising:
- providing a patterned conductive carrier including a support segment having a partially etched recess;
- situating an integrated circuit (IC) on said support segment;
- coupling said IC to said partially etched recess by an electrical connector;
- forming a packaging dielectric over said patterned conductive carrier and said IC, said packaging dielectric interfacing with and mechanically engaging said partially etched recess so as to prevent delamination of said electrical connector.
Dependencies are inferred from the claim text.