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US 2016/0104685 A1Published application
Improving the Strength of Micro-Bump Joints
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Ming-Fa Chen, Rung-De Wang
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Abstract
A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the portion of the dielectric layer form an interface. A metal finish is formed over and contacting the metal bump. The metal finish extends from over the dielectric layer to below the interface.
Claims20
A bump structure comprising:
- a metal pad;
- a passivation layer over the metal pad, the passivation layer having an opening exposing a portion of the metal pad;
- and
- a metal bump over the metal pad, the metal bump having a lip extending laterally beneath a lowermost surface of the passivation layer, the lip anchoring the metal bump to the passivation layer.
1 more element
A structure comprising:
- a top die including a first bump structure;
- and
- a bottom die mounted to the top die, the bottom die including a second bump structure having a metal bump with a lip extending laterally beneath a lowermost surface of a passivation layer, the lip anchoring the metal bump to the passivation layer.
A method comprising:
- forming an opening in a passivation layer to expose a metal pad on an integrated circuit die;
- etching the metal pad to form an undercut beneath the passivation layer;
- and
- forming a bump on the metal pad, the bump having a lip projecting into the undercut, the bump being configured to be directly connected to an external device.
1 more element
Dependencies are inferred from the claim text.